Method and apparatus for attachment of edge connector to substra

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

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29843, 22818022, H05K 334

Patent

active

056094906

ABSTRACT:
A method and apparatus attach a connector (17) to an edge (32) of a substrate (18) such that an electrical connection is formed between the circuits on the substrate (18) and the leads (12, 14) on the connector (17). A connector (17) is provided having leads arranged into a top row (12) and a bottom row (14) extending horizontally therefrom. A substrate (18) is provided having a row of solder bumps (20) on a bottom side to correspond with the bottom row of leads (14) of the connector (17) and a row of solder paste pads (22) on a top side to correspond with the top row of leads (12) of the connector (17). The edge (32) of the substrate (18) is approached with the connector (17) at an angle, straddling the edge (32) with the top row (12) and the bottom row (14) of leads, and rotating the connector (17) into parallel alignment with the substrate (18). The substrate (18) is heated to reflow, such that the row of solder paste pads (22) on the top side of the substrate (18) liquefies and flows onto a row of connection sites, thereby contacting the top row of leads (12). The row of bumps (20) on the bottom side of the substrate (18) wets the row of bottom leads (14), thereby forming the electrical connection.

REFERENCES:
patent: 5311405 (1994-05-01), Tribbey et al.
patent: 5415573 (1995-05-01), Chen et al.
Toddco General, Inc., PCMCIA Memory Card Connector Assembly System, Model TRSM 1010A Brochure.

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