Metal fusion bonding – Process – Preplacing solid filler
Patent
1988-11-21
1990-02-06
Godici, Nicholas P.
Metal fusion bonding
Process
Preplacing solid filler
228254, 228 33, 427250, 427282, B23K 3102, B23K 3706
Patent
active
048983209
ABSTRACT:
Disclosed is a method of manufacturing a high-yield solder bumped semiconductor wafer. The method comprises providing a non-solderable transfer substrate having a transfer surface for receipt of solder material; depositing solder material onto the transfer surface to form solder bumps in a predetermined pattern; aligning solderable conductive elements of a semiconductor wafer with the predetermined solder bumps on the transfer surface; and reflowing the patterned solder bumps into wetted contact with the wafer conductive elements.
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patent: 4722470 (1988-02-01), Johary
patent: 4759491 (1988-07-01), Fisher
IBM Technical Disclosure Bulletin, vol. 28, No. 7, p. 2871, Dec., 1985.
IBM Technical Disclosure Bulletin, vol. 14, No. 9, p. 2773, Feb., 1972.
"Electronics" magazine, Sized Solder Bumps, vol. 54, No. 22, pp. 46-48, Nov. 3, 1981.
Electronic Packaging and Production, article titled "Japan's Swing to Chip-on-Board," Dec. 1986, pp. 38-41.
Dicks Lori A.
Dunaway Thomas J.
Spielberger Richard K.
Godici Nicholas P.
Heinrich Samuel M.
Honeywell Inc.
Udseth W. T.
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