Printed circuit assembly

Details Printed circuit assembly Printed circuit assembly

1990-06-22

1991-07-23

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

G11C 1100

Patent

active

050348558

ABSTRACT:
On a printed circuit board, according to the present invention, IC packages are arranged in a matrix layout. The IC packages are soldered to the printed circuit board via their lead wires provided on the package sides along row and column lines of the matrix chip components are soldered to the printed circuit board, under each of the IC packages along lines angularly deviated from the row lines or the column lines of the matrix. Thus, the soldered portion of a chip component behind its adjacent chip component can be visually inspected along a view line parallel to the row line or the column line on a highly integrated printed circuit board.

REFERENCES:
patent: 4739444 (1988-04-01), Zushi et al.
patent: 4754366 (1988-06-01), Hernandez

Affiliated with

Also associated with

Rating

Printed circuit assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-437097