Method of manufacturing a parent material for wooden patterns

Plastic and nonmetallic article shaping or treating: processes – Forming articles by uniting randomly associated particles

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B27N 300

Patent

active

052961761

ABSTRACT:
Disclosed is a parent material for wooden patterns which is made free of direction due to grain unlike in natural timber, stickiness caused by heat during cutting process unlike thermoplastic resin foam and micro-vibration due to foam, and which can prevent occurrence of distortion in the pattern made thereof, can afford so thick mold as more than 50 millimeter in spite of using wood flour as a base material and can be plated, and to provide a method of producing such a parent material. As base materials 50 to 70% by weight of 80 to 200 mesh wood flour and 30 to 50% by weight of a self-hardening resin constituted of a main resin, a hardening agent and an accelerator are used for kneading together and the mixture is subjected to molding under pressure at ordinary temperature so as to regulate water absorption to 3% or lower for every 24 hours for obtaining a product in specified size and in high density.

REFERENCES:
patent: 4627951 (1986-12-01), Shen
patent: 4882112 (1989-11-01), Maki et al.
patent: 4933232 (1990-06-01), Trout et al.
patent: 5002713 (1991-03-01), Palardy et al.
patent: 5064592 (1991-11-01), Ueda et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a parent material for wooden patterns does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a parent material for wooden patterns, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a parent material for wooden patterns will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-434717

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.