Metal treatment – Compositions – Fluxing
Patent
1993-08-16
1994-03-22
Rosenberg, Peter D.
Metal treatment
Compositions
Fluxing
148 24, 148 25, B23K 3534
Patent
active
052960463
ABSTRACT:
A fluxing composition for soldering metals together, contains a carrier solvent, an oxide removing agent, and a nitrogen liberating compound. The oxide removing agent sublimes at or below the temperature at which the metals are soldered together. The nitrogen liberating compound sublimes or decomposes at below the temperature at which the metals are soldered together in order to provide a blanket of inert gas over the metals being soldered. The oxide removing agent is 2-amino-isophthalic acid, 5-amino-isophthalic acid, isophthalic acid, ammonium fluoborate, or ammonium salicylate. The compound that liberates nitrogen upon heating is 1,2-benz-3,4-anthraquinone, 1,2-benz-9,10-anthraquinone, 5,6-chrysoquinone, 6,12-chrysoquinone, 2,3-benzanthraquinone, 2-amino-isophthalic acid, 5-amino-isophthalic acid, or 5-isoquinoline carboxylonitrile. Electronic components are soldered to a circuit board by applying the fluxing composition to the circuit board. The fluxing composition, the component and the circuit board are heated to a temperature sufficient to cause the activator to react with metal oxides on either the component or the circuit board and to sublime, and also to a temperature to cause the nitrogen containing compound to decompose or sublime.
REFERENCES:
patent: 5064481 (1991-11-01), Davis et al.
patent: 5094701 (1992-03-01), Norman
patent: 5211763 (1993-05-01), Takemoto
Hendricks Douglas W.
Juskey Frank J.
Dorinski Dale W.
Motorola Inc.
Rosenberg Peter D.
LandOfFree
Subliming solder flux composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Subliming solder flux composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Subliming solder flux composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-433698