Cutting mechanism for dry film laminator

Details Cutting mechanism for dry film laminator Cutting mechanism for dry film laminator

2010-02-03

2011-12-06

Gray, Linda L (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With cutting, punching, piercing, severing, or tearing

C156S566000, C156S556000

Reexamination Certificate

active

08069893

ABSTRACT:
A cutting mechanism for dry film laminator includes a main base connected to a dry film laminator. The main base has a cutting space defined therein. The main base has two rollers disposed thereon and located beside the cutting space. The two rollers flatly guide a film above the cutting space. A film-carrying device is movably disposed on the main base. The film-carrying device includes a suction member movably disposed thereon. The suction member has at least one annular groove defined therein and corresponding to a shape of a wafer. A cutting device is movably disposed below the main base. The cutting device includes a film cutter movably disposed thereon. The cutting device includes an elevating device disposed thereon for moving the film cutter upward/downward. The cutting device includes a motor disposed thereon for rotating the film cutter.

REFERENCES:
patent: 4925515 (1990-05-01), Yoshimura et al.
patent: 6238515 (2001-05-01), Tsujimoto et al.
patent: 6689245 (2004-02-01), Tsujimoto
patent: 2003/0131929 (2003-07-01), Yamamoto

Affiliated with

Also associated with

Rating

Cutting mechanism for dry film laminator does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cutting mechanism for dry film laminator, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cutting mechanism for dry film laminator will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4316260