Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-06-25
2011-12-20
Pape, Zachary M (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C361S679530, C165S080400, C165S080500, C165S104330, C257S714000, C257S715000, C174S015100
Reexamination Certificate
active
08081461
ABSTRACT:
A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid coolant supply. The thermally conductive porous material (such as metal foam material) is coupled to a surface of the electronic device to be cooled, or a structure coupled to the electronic device. The liquid coolant supply includes a jet impingement structure, which includes one or more jet nozzles for directing liquid coolant onto the surface to be cooled. The jet nozzle(s) extends into the thermally conductive porous material, and facilitates delivery of liquid coolant onto the surface to be cooled. The thermally conductive porous material is in thermal contact with the surface to be cooled and facilitates cooling of the electronic device by boiling of the liquid coolant passing through the porous material.
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Campbell et al., “Cooling Apparatus and Method of Fabrication Thereof with Jet Impingement Structure Integrally Formed on Thermally Conductive Pin Fins”, U.S. Appl. No. 12/141,290, filed Jun. 18, 2008.
Campbell Et al., “Cooling Apparatus and Method of Fabrication Thereof with a Cold Plate Formed In Situ on a Surface to be Cooled”, U.S. Appl. No. 12/143,289, filed Jun. 20, 2008.
Campbell Levi A.
Chu Richard C.
Ellsworth, Jr. Michael J.
Iyengar Madhusudan K.
Simons Robert E.
Heslin Rothenberg Farley & & Mesiti P.C.
International Business Machines - Corporation
Jung, Esq. Dennis
Pape Zachary M
Radigan, Esq. Kevin P.
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