Method for producing a buffer pad

Details Method for producing a buffer pad Method for producing a buffer pad

2009-07-10

2011-11-22

Chan, Sing P (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S249000, C156S250000

Reexamination Certificate

active

08062456

ABSTRACT:
A method for producing a buffer pad is provided with the following steps: cutting a plate into a mesh and a plurality of blocks; the mesh has a plurality of mesh holes, and the blocks have a shape corresponding to the mesh holes and are engaged with the mesh holes respectively; releasably attaching the cut plate to a sticky surface of a substrate, thereby the first surface of the block are temporarily attached to the substrate; separating the mesh from the substrate, and the blocks disengaging from the mesh holes and being left on the substrate; coating the second surfaces of the blocks with adhesive; attaching a film to the second surfaces of the blocks; separating the blocks from the sticky surface of the substrate. Thereby, a buffer pad is produced.

REFERENCES:
patent: 3020186 (1962-02-01), Lawrence
patent: 4360015 (1982-11-01), Mayer
patent: 2001/0045147 (2001-11-01), Schultes
patent: 2010/0193117 (2010-08-01), Kim

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