Method of construction of CTE matching structure with wafer...

Details Method of construction of CTE matching structure with wafer... Method of construction of CTE matching structure with wafer...

2009-08-11

2011-12-27

Roman, Angel (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S068000, C438S113000, C257SE21001

Reexamination Certificate

active

08084288

ABSTRACT:
A method includes bonding a first side of a metal shim to a silicon shim, removing metal from the metal shim to form a plurality of cleared metal lanes in accordance with a pattern, bonding a readout integrated circuit having a plurality of saw lanes in accordance with the pattern to a second side of the metal shim to form a wafer assembly wherein the plurality of saw lanes is aligned with the plurality of cleared metal lanes, and dicing the wafer assembly.

REFERENCES:
patent: 5264699 (1993-11-01), Barton et al.
patent: 5308980 (1994-05-01), Barton
patent: 5672545 (1997-09-01), Trautt et al.
patent: 6417514 (2002-07-01), Eneim et al.
patent: 7375420 (2008-05-01), Fisher et al.
patent: 2004/0207074 (2004-10-01), MacDonald et al.
patent: 2008/0057625 (2008-03-01), Chan et al.

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