Substrate for mounting IC chip

Details Substrate for mounting IC chip Substrate for mounting IC chip

2003-03-28

2011-12-13

Louie, Wai-Sing (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S621000, C257S772000, C257S779000

Reexamination Certificate

active

08076782

ABSTRACT:
An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal.The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.

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Machine translation of JP2002-329891 has been attached.
Ray T. Chen, et al., “Fully Embedded Board-Level Guided-Wave Optoelectronic Interconnects”, Proceedings of the IEEE, vol. 88, No. 6, Jun. 2000, pp. 780-793.
Yuzo Ishii, et al., “Large-Tolerant “OptoBumP” Interface for Interchip Optical Interconnections”, IEICE Transactions C, vol. J84-C, No. 9, Sep. 2001, pp. 793-799, with partial English translation.

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