Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-10-25
2011-11-22
Monbleau, Davienne (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S675000, C257S706000, C257SE33075
Reexamination Certificate
active
08063484
ABSTRACT:
A semiconductor device, comprising: a semiconductor element20having a rectangular two-dimensional geometry and serving as a heat source; and a heat sink section25having the semiconductor element20mounted thereon, wherein a relation among the directional components of said thermal conductivity is: Kzz≧Kyy>Kxx, where directional components of three-dimensional thermal conductivity of the heat sink section25in X, Y and Z directions are determined as Kxx, Kyy and Kzz, and where the longer side direction of the semiconductor element20is defined as X direction, the shorter side direction thereof is defined as Y direction and the thickness direction is defined as Z direction.
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European Search Report dated Apr. 26, 2010.
Kuroda Naotaka
Miyamoto Hironobu
Tanomura Masahiro
Wakejima Akio
Arroyo Teresa M
McGinn IP Law Group PLLC
Monbleau Davienne
NEC Corporation
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