Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2010-04-30
2011-12-27
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S707000, C165S080300, C165S080400, C174S015100, C174S015200, C174S016100
Reexamination Certificate
active
08085542
ABSTRACT:
A heat dissipation device for a first electronic component and a second electronic component mounted on a circuit board includes a first base mounted on the first electronic component and a second base mounted on the second electronic component. The second base is movably connected with the first base. An electronic system incorporating the heat dissipation device is also provided.
REFERENCES:
patent: 6125035 (2000-09-01), Hood et al.
patent: 7304846 (2007-12-01), Wang et al.
patent: 7325590 (2008-02-01), Kim et al.
patent: 7327576 (2008-02-01), Lee et al.
patent: 7372702 (2008-05-01), Gauche et al.
patent: 7411791 (2008-08-01), Chang et al.
patent: 7511947 (2009-03-01), Leng et al.
patent: 7885075 (2011-02-01), Li et al.
patent: 7990699 (2011-08-01), Lian et al.
Altis Law Group, Inc.
Chervinsky Boris
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
LandOfFree
Heat dissipation device and electronic system incorporating... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat dissipation device and electronic system incorporating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipation device and electronic system incorporating... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4303484