Heat dissipation device and electronic system incorporating...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S707000, C165S080300, C165S080400, C174S015100, C174S015200, C174S016100

Reexamination Certificate

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08085542

ABSTRACT:
A heat dissipation device for a first electronic component and a second electronic component mounted on a circuit board includes a first base mounted on the first electronic component and a second base mounted on the second electronic component. The second base is movably connected with the first base. An electronic system incorporating the heat dissipation device is also provided.

REFERENCES:
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patent: 7304846 (2007-12-01), Wang et al.
patent: 7325590 (2008-02-01), Kim et al.
patent: 7327576 (2008-02-01), Lee et al.
patent: 7372702 (2008-05-01), Gauche et al.
patent: 7411791 (2008-08-01), Chang et al.
patent: 7511947 (2009-03-01), Leng et al.
patent: 7885075 (2011-02-01), Li et al.
patent: 7990699 (2011-08-01), Lian et al.

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