Semiconductor module and method for fabricating...

Details Semiconductor module and method for fabricating... Semiconductor module and method for fabricating...

2007-09-13

2011-10-04

Andujar, Leonardo (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S720000, C257SE23101, C257SE23103, C257S717000

Reexamination Certificate

active

08030758

ABSTRACT:
A semiconductor module (10) includes a heat sink (1), an electronic component (2), a semiconductor device (3), and a thermally-conductive sheet member (4). The thermally-conductive sheet member (4) covers a part of the semiconductor device (3) and has a lower part (4b) and a side part (4c). The lower part (4b) is in contact with a mounting face (11a) of the heat sink (1). The side part (4c) extends from the lower part (4b) and covers a first side surface (3c) of the semiconductor device (3). The electronic component (2) is disposed across the side part (4c) of the thermally-conductive sheet member (4) from the semiconductor device (3).

REFERENCES:
patent: 4103737 (1978-08-01), Perkins
patent: 4508163 (1985-04-01), McCarthy
patent: 5291065 (1994-03-01), Arai et al.
patent: 2002/0167800 (2002-11-01), Smalc
patent: 2003/0210719 (2003-11-01), Yamamoto et al.
patent: 2007/0181908 (2007-08-01), Otremba
patent: 2005-235929 (2005-09-01), None
patent: 2005-251994 (2005-09-01), None

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