Method for fabricating embedded thin film resistors of...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S610100, C029S829000, C029S844000, C438S112000, C438S126000, C438S382000, C438S754000, C438S778000

Reexamination Certificate

active

08042261

ABSTRACT:
A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. In comparison with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the parasitic capacitive reactance effect caused by two contact ends of the conventional resistors is also avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

REFERENCES:
patent: 6281090 (2001-08-01), Kukanskis et al.
patent: 7213327 (2007-05-01), Su et al.

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