Single-chip and multi-chip module for proximity communication

Details Single-chip and multi-chip module for proximity communication Single-chip and multi-chip module for proximity communication

2006-02-22

2011-12-06

Dinh, Tuan T (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S784000, C361S803000

Reexamination Certificate

active

08072772

ABSTRACT:
An apparatus includes a two-dimensional array of single-chip modules (SCMs) and at least one component. A respective SCM in the array includes at least a semiconductor die that is configured to communicate data signals by capacitive coupling using one or more proximity connectors in a first set of proximity connectors. The first set of proximity connectors are coupled to the semiconductor die. A second set of proximity connectors is coupled to at least the one component. At least the one component is coupled to semiconductor dies in two or more SCMs using one or more proximity connectors in the second set of proximity connectors thereby enabling communication of the data signals by capacitive coupling.

REFERENCES:
patent: 6410983 (2002-06-01), Moriizumi et al.
patent: 6952352 (2005-10-01), Emma et al.
patent: 7480152 (2009-01-01), Goodwin

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