Overmolded electronics enclosure

Details Overmolded electronics enclosure Overmolded electronics enclosure

2009-07-06

2011-12-20

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S688000, C361S690000, C361S816000, C361S818000

Reexamination Certificate

active

08081466

ABSTRACT:
An enclosure for electronics includes a body with a metal component and a polymeric component overmolded onto the metal component so as to be connected to the metal component without fasteners. The body defines a recess. A heat sink is defined in the metal component. A printed circuit board is located in the recess and includes a plurality of electronic components mounted thereon. The polymeric component includes at least one attachment feature that captures the printed circuit board at a select location in the recess such that: (i) at least a first one of the electronic components is electrically connected to a contact region of the metal component that is exposed through a portion of said polymeric component; (ii) at least a second one of the electronic components is electrically isolated from the metal component by an electrical isolation zone of the polymeric component; and (ii) at least a third one of the electronic components is located adjacent a thermal transfer region of the metal component that underlies the heat sink. The thermal transfer region is uncovered by the polymeric component so as to be exposed in the recess.

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