Ceramic substrate part and electronic part comprising it

Details Ceramic substrate part and electronic part comprising it Ceramic substrate part and electronic part comprising it

2007-09-26

2011-11-22

Chen, Xiaoliang (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S250000, C174S255000, C174S257000, C174S262000, C427S123000, C427S165000, C427S537000, C428S209000, C428S447000, C428S607000, C428S680000, C428S704000, C438S063000, C438S099000, C438S149000, C438S667000, C438S678000, C257S066000, C257S106000, C257S712000, C257S737000, C257S778000

Reexamination Certificate

active

08064219

ABSTRACT:
A ceramic substrate part comprising on its upper surface pluralities of external electrodes comprising wire-bonding electrodes, each of which comprises a primer layer based on Ag or Cu, a Ni-based lower layer, an intermediate layer based on a Pd—P alloy containing 0.4-5% by mass of P, and a Au-based upper layer formed in this order on a ceramic substrate, the upper layer containing Pd after heated by soldering, and having a Au concentration of 80 atomic % or more based on the total concentration (100 atomic %) of Au and Pd.

REFERENCES:
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patent: 2003/0071319 (2003-04-01), Stierman et al.
patent: 2005/0200015 (2005-09-01), Obiya
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patent: 2005-259915 (2005-09-01), None
patent: 2006-196648 (2006-07-01), None
Extended European Search Report corresponding to European Patent Application No. 07 828 463.5 dated Mar. 26, 2010.

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