Semiconductor device and manufacturing method of the same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S766000, C361S793000, C361S794000, C361S807000, C361S301100

Reexamination Certificate

active

08035981

ABSTRACT:
A semiconductor device includes a semiconductor element, a supporting substrate where the semiconductor element is mounted, and a capacitor provided on the semiconductor element and coupled to the supporting substrate via an outside connection terminal. The capacitor includes a valve metal part, an anodic oxide film formed on a surface of the valve metal part, and a conductive part formed on the anodic oxide film and made of a conductive material.

REFERENCES:
patent: 5019949 (1991-05-01), Ikeda et al.
patent: 6222260 (2001-04-01), Liang et al.
patent: 6243256 (2001-06-01), Furuta et al.
patent: 6787926 (2004-09-01), Chen et al.
patent: 6973035 (2005-12-01), Seddigh et al.
patent: 7268997 (2007-09-01), Saitou et al.
patent: 2004/0183170 (2004-09-01), Tomimatsu
patent: 2005/0135041 (2005-06-01), Kang et al.
patent: 2005/0213282 (2005-09-01), Kondo et al.
patent: 2007/0054438 (2007-03-01), Huang et al.
patent: 2007/0159771 (2007-07-01), Saito et al.
patent: 07-176453 (1995-07-01), None
patent: 10-097952 (1998-04-01), None
patent: 11-097952 (1999-04-01), None
patent: 2003-197463 (2003-07-01), None
patent: 2006-254427 (2006-09-01), None
patent: 2006-265591 (2006-10-01), None

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