Electrostatic discharge structures and methods of manufacture

Details Electrostatic discharge structures and methods of manufacture Electrostatic discharge structures and methods of manufacture

2009-06-23

2011-11-08

Nguyen, Danny (Department: 2836)

Electricity: electrical systems and devices

Safety and protection of systems and devices

Load shunting by fault responsive means

C361S111000

Reexamination Certificate

active

08054597

ABSTRACT:
Electrostatic discharge (ESD) structures having a connection to a through wafer via structure and methods of manufacture are provided. The structure includes an electrostatic discharge (ESD) network electrically connected in series to a through wafer via. More specifically, the ESD circuit includes a bond pad and an ESD network located under the bond pad. The ESD circuit further includes a through wafer via structure electrically connected in series directly to the ESD network, and which is also electrically connected to VSS.

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