Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2008-09-25
2011-11-15
Dinh, Trinh (Department: 2821)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C343S873000, C343S7000MS, C343S702000, C257S782000
Reexamination Certificate
active
08058714
ABSTRACT:
According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die and the package substrate. The overmolded semiconductor package further includes a conductive layer situated on an outer surface of the mold compound and having an opening. The overmolded semiconductor package further includes an antenna feed line situated in the mold compound and having a portion exposed in the opening in the conductive layer, thereby providing an antenna input on the outer surface of the mold compound.
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Lee Gye-An
Noll Thomas
Dinh Trinh
Lando & Anastasi LLP
Skyworks Solutions Inc.
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