Methods for coupling diamond structures to photonic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide

Reexamination Certificate

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C438S031000, C438S105000

Reexamination Certificate

active

08039845

ABSTRACT:
Various embodiments of the present invention are directed to methods for coupling semiconductor-based photonic devices to diamond. In one embodiment of the present invention, a photonic device is optically coupled with a diamond structure. The photonic device comprises a semiconductor material and is optically coupled with the diamond structure with an adhesive substance that adheres the photonic device to the diamond structure. A method for coupling the photonic device with the diamond structure is also provided. The method comprises: depositing a semiconductor material on the diamond structure; forming the photonic device in the semiconductor material so that the photonic device couples with the diamond structure; and adhering the photonic device to the diamond structure.

REFERENCES:
patent: 4685988 (1987-08-01), Wagner et al.
patent: 6468823 (2002-10-01), Scherer et al.
patent: 7546013 (2009-06-01), Santori et al.
patent: 2007/0053640 (2007-03-01), Goell et al.
patent: 2007/0277730 (2007-12-01), Rabeau et al.
patent: 2008/0063339 (2008-03-01), Spillane

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