Apparatus and method for ion beam implantation using...

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

08044375

ABSTRACT:
An ion implantation apparatus with multiple operating modes is disclosed. The ion implantation apparatus has an ion source and an ion extraction means for forming a converging beam on AMU-non-dispersive plane therefrom. The ion implantation apparatus includes magnetic scanner prior to a magnetic analyzer for scanning the beam on the non-dispersive plane, the magnetic analyzer for selecting ions with specific mass-to-charge ratio to pass through a mass slit to project onto a substrate. A rectangular quadruple magnet is provided to collimate the scanned ion beam and fine corrections of the beam incident angles onto a target. A deceleration or acceleration system incorporating energy filtering is at downstream of the beam collimator. A two-dimensional mechanical scanning system for scanning the target is disclosed, in which a beam diagnostic means is build in.

REFERENCES:
patent: 6918351 (2005-07-01), Chen et al.
patent: 7851773 (2010-12-01), Glavish et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for ion beam implantation using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for ion beam implantation using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for ion beam implantation using... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4294469

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.