Method of forming leads of semiconductor device to shape

Details Method of forming leads of semiconductor device to shape Method of forming leads of semiconductor device to shape

1993-04-27

1994-03-22

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29 33M, 29566, 437220, H01R 4300

Patent

active

052952983

ABSTRACT:
A semiconductor device of the SOP type packaged on a lead frame and separated individually is fed into a lead-forming position by a holder, and the distal ends of leads arrayed on one side of the semiconductor device are imaged by a camera. The image data from the camera is processed by a recognition unit, which outputs the actual position of the semiconductor device. If the recognized actual position is different from the position to start forming leads, then a controller actuates the holder to eliminate the positional error and to position the semiconductor accurately in the lead-forming position. Based on data corresponding to the type of the semiconductor device, the lead bases of the leads are held by a lead-fixing finger assembly, and the distal end portions of the leads are bent arcuately by a lead-forming finger assembly, thereby forming the leads to a predetermined shape. Then, the leads on the opposite side of the semiconductor device are similarly formed to shape after the semiconductor device has been turned 180.degree. by the holder. To form the leads arrayed on four sides of a semiconductor device of the QFP type, two arrays of leads are simultaneously formed to shape by lead-forming devices disposed one on each side of the lead-forming position, and then two other arrays of leads are simultaneously formed by the lead-forming assemblies. Therefore, the leads can be formed to shape in two cycles of operation.

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