Material and method of manufacturing of a solder joint with...

Details Material and method of manufacturing of a solder joint with... Material and method of manufacturing of a solder joint with...

2010-06-09

2011-10-11

King, Roy (Department: 1733)

Metal treatment

Compositions

Fluxing

C075S255000, C428S570000, C106S001050

Reexamination Certificate

active

08034195

ABSTRACT:
A solder composition for forming a solder joint. The composition includes a powder material including a solid metal matrix material and a filler material. The solid metal matrix material includes one or more of tin-silver-copper (Sn—Ag—Cu), tin-copper (Sn—Cu), tin-copper-nickel (Sn—Cu—Ni), tin-silver (Sn—Ag), tin-silver-bismuth (Sn—Ag—Bi), tin-bismuth-indium (Sn—Bi—In), tin-gold (Au—Sn), tin-zinc (Sn—Zn), tin-zinc-bismuth (Sn—Zn—Bi), tin-bismuth-silver (Sn—Bi—Ag), tin (Sn), tin-indium (Sn—In), indium (In), indium-silver (In—Ag), and tin-lead (Sn—Pb). The filler material includes one or more of copper (Cu), gold (Au), nickel (Ni), nickel-gold (Ni—Au), carbon, silver (Ag), aluminum (Al), molybdenum (Mo), nickel (Ni) or nickel-gold (Ni—Au) coated carbon, the platinum group metals (PGM's), and their alloys.

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English language translation of Chinese Office Action issued in counterpart application No. 200710186320.0 (6 pages), Nov. 13, 2006.

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