Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate
2009-05-28
2011-11-08
Wagner, Jenny L (Department: 2891)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
C438S025000
Reexamination Certificate
active
08053253
ABSTRACT:
An object is to provide a highly reliable semiconductor device that has tolerance to external stress and electrostatic discharge. Another object is to prevent defective shapes and defective characteristics due to the external stress or an electrostatic discharge in the manufacturing process, and to manufacture a semiconductor device with high yield. Still another object is to manufacture a semiconductor device at low cost and with high productivity. With the use of a conductive shield covering a semiconductor integrated circuit, electrostatic breakdown due to electrostatic discharge of the semiconductor integrated circuit is prevented. The conductive shield is formed so that at least the conductive shields on the top and bottom surfaces are electrically connected by a plating method. In addition, a semiconductor device can be formed at low cost with high productivity because a plating method is used for the formation of the conductive shield.
REFERENCES:
patent: 5075166 (1991-12-01), Sikorski et al.
patent: 5597631 (1997-01-01), Furumoto et al.
patent: 5757456 (1998-05-01), Yamazaki et al.
patent: 5770313 (1998-06-01), Furumoto et al.
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 6015724 (2000-01-01), Yamazaki
patent: 6118502 (2000-09-01), Yamazaki et al.
patent: 6224965 (2001-05-01), Haas et al.
patent: 6376333 (2002-04-01), Yamazaki et al.
patent: 6403221 (2002-06-01), Nakamura et al.
patent: 6491228 (2002-12-01), Ueda et al.
patent: 6762508 (2004-07-01), Kiso et al.
patent: 6800223 (2004-10-01), Kojo et al.
patent: 6933533 (2005-08-01), Yamazaki et al.
patent: 6953951 (2005-10-01), Yamazaki et al.
patent: 6998282 (2006-02-01), Yamazaki et al.
patent: 7049178 (2006-05-01), Kim et al.
patent: 7050138 (2006-05-01), Yamazaki et al.
patent: 7061083 (2006-06-01), Usami et al.
patent: 7342490 (2008-03-01), Herrmann et al.
patent: 7361519 (2008-04-01), Yamazaki et al.
patent: 7374977 (2008-05-01), Yamazaki et al.
patent: 7459352 (2008-12-01), Yamazaki et al.
patent: 7485489 (2009-02-01), Björbell
patent: 7487373 (2009-02-01), Koyama
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2003/0071953 (2003-04-01), Yamazaki et al.
patent: 2004/0016939 (2004-01-01), Akiba et al.
patent: 2004/0229404 (2004-11-01), Kiso et al.
patent: 2005/0070038 (2005-03-01), Yamazaki et al.
patent: 2005/0085034 (2005-04-01), Akiba et al.
patent: 2005/0162578 (2005-07-01), Yamazaki et al.
patent: 2005/0200301 (2005-09-01), Yamazaki et al.
patent: 2005/0233122 (2005-10-01), Nishimura et al.
patent: 2006/0011288 (2006-01-01), Watanabe et al.
patent: 2007/0004125 (2007-01-01), Watanabe et al.
patent: 2007/0004202 (2007-01-01), Fujii
patent: 2007/0020932 (2007-01-01), Maruyama et al.
patent: 2007/0023758 (2007-02-01), Tsurume et al.
patent: 2007/0026580 (2007-02-01), Fujii
patent: 2007/0030205 (2007-02-01), Farrell et al.
patent: 2007/0030681 (2007-02-01), Farrell et al.
patent: 2007/0044303 (2007-03-01), Yamano
patent: 2007/0077691 (2007-04-01), Watanabe
patent: 2007/0181875 (2007-08-01), Yamazaki et al.
patent: 2007/0259585 (2007-11-01), Yamazaki et al.
patent: 2007/0278563 (2007-12-01), Takano et al.
patent: 2008/0012126 (2008-01-01), Dozen et al.
patent: 2008/0044940 (2008-02-01), Watanabe et al.
patent: 2008/0054976 (2008-03-01), Endo et al.
patent: 2008/0093464 (2008-04-01), Dairiki et al.
patent: 2008/0186185 (2008-08-01), Herrmann et al.
patent: 2008/0224941 (2008-09-01), Sugiyama et al.
patent: 2008/0252531 (2008-10-01), Hanaoka et al.
patent: 2008/0280033 (2008-11-01), Yamazaki et al.
patent: 2008/0303140 (2008-12-01), Ohtani et al.
patent: 2008/0309581 (2008-12-01), Fujii et al.
patent: 2009/0278252 (2009-11-01), Oikawa et al.
patent: 2009/0289340 (2009-11-01), Yamazaki et al.
patent: 2009/0289341 (2009-11-01), Yamazaki et al.
patent: 2009/0302455 (2009-12-01), Chida et al.
patent: 0 939 441 (1999-09-01), None
patent: 1092739 (2001-04-01), None
patent: 1589797 (2005-10-01), None
patent: 1 758 438 (2007-02-01), None
patent: 1 970 951 (2008-09-01), None
patent: 05-190582 (1993-07-01), None
patent: 06-350250 (1994-12-01), None
patent: 08-250745 (1996-09-01), None
patent: 08-288522 (1996-11-01), None
patent: 09-156265 (1997-06-01), None
patent: 10-092980 (1998-04-01), None
patent: 10-211784 (1998-08-01), None
patent: 10-302027 (1998-11-01), None
patent: 2000-231619 (2000-08-01), None
patent: 2001-277726 (2001-10-01), None
patent: 2003-141486 (2003-05-01), None
patent: 2003-174153 (2003-06-01), None
patent: 2004-118255 (2004-04-01), None
patent: 2004-362341 (2004-12-01), None
patent: 2006-139802 (2006-06-01), None
patent: 2007-241999 (2007-09-01), None
patent: WO 96/09158 (1996-03-01), None
patent: WO 01/01740 (2001-01-01), None
patent: WO 04/001848 (2003-12-01), None
patent: WO 2006/038438 (2006-04-01), None
Quirk, Michael and Julian Serda, Semiconductor Manufacturing Technology, 2001, Prentice-Hall, Inc, p. 323.
Fujii Teruyuki
Goto Yuugo
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
Wagner Jenny L
LandOfFree
Method for manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4289873