Lithographic apparatus, device manufacturing method and...

Photocopying – Projection printing and copying cameras – Step and repeat

Reexamination Certificate

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C355S072000

Reexamination Certificate

active

08068210

ABSTRACT:
Additional vibrations are added during the exposure of a substrate so that vibrations occurring during exposure of a plurality of areas on the substrate are substantially uniform. This may improve CD uniformity.

REFERENCES:
patent: 3573975 (1971-04-01), Dhaka et al.
patent: 3648587 (1972-03-01), Stevens
patent: 4346164 (1982-08-01), Tabarelli et al.
patent: 4390273 (1983-06-01), Loebach et al.
patent: 4396705 (1983-08-01), Akeyama et al.
patent: 4480910 (1984-11-01), Takanashi et al.
patent: 4509852 (1985-04-01), Tabarelli et al.
patent: 5040020 (1991-08-01), Rauschenbach et al.
patent: 5610683 (1997-03-01), Takahashi
patent: 5715039 (1998-02-01), Fukuda et al.
patent: 5825043 (1998-10-01), Suwa
patent: 5900354 (1999-05-01), Batchelder
patent: 6191429 (2001-02-01), Suwa
patent: 6236634 (2001-05-01), Lee et al.
patent: 6327024 (2001-12-01), Hayashi et al.
patent: 6490025 (2002-12-01), Makinouchi et al.
patent: 6560032 (2003-05-01), Hatano
patent: 6600547 (2003-07-01), Watson et al.
patent: 6603130 (2003-08-01), Bisschops et al.
patent: 6633365 (2003-10-01), Suenaga
patent: 6881963 (2005-04-01), Ito
patent: 7063192 (2006-06-01), Mayama
patent: 7355674 (2008-04-01), De Klerk
patent: 2002/0020821 (2002-02-01), Van Santen et al.
patent: 2002/0163629 (2002-11-01), Switkes et al.
patent: 2003/0123040 (2003-07-01), Almogy
patent: 2003/0146554 (2003-08-01), Kato
patent: 2003/0174408 (2003-09-01), Rostalski et al.
patent: 2004/0000627 (2004-01-01), Schuster
patent: 2004/0021844 (2004-02-01), Suenaga
patent: 2004/0075895 (2004-04-01), Lin
patent: 2004/0109237 (2004-06-01), Epple et al.
patent: 2004/0114117 (2004-06-01), Bleeker
patent: 2004/0119954 (2004-06-01), Kawashima et al.
patent: 2004/0125351 (2004-07-01), Krautschik
patent: 2004/0135099 (2004-07-01), Simon et al.
patent: 2004/0136494 (2004-07-01), Lof et al.
patent: 2004/0160582 (2004-08-01), De Smit et al.
patent: 2004/0165159 (2004-08-01), Lof et al.
patent: 2004/0207824 (2004-10-01), Lof et al.
patent: 2004/0211920 (2004-10-01), Derksen et al.
patent: 2005/0094116 (2005-05-01), Flagello et al.
patent: 2005/0110973 (2005-05-01), Streefkerk et al.
patent: 2005/0132914 (2005-06-01), Mulkens et al.
patent: 2005/0134815 (2005-06-01), Van Santen et al.
patent: 2005/0219481 (2005-10-01), Cox et al.
patent: 206 607 (1984-02-01), None
patent: 221 563 (1985-04-01), None
patent: 224448 (1985-07-01), None
patent: 242880 (1987-02-01), None
patent: 0023231 (1981-02-01), None
patent: 0342040 (1989-11-01), None
patent: 0418427 (1991-03-01), None
patent: 1039511 (2000-09-01), None
patent: 2474708 (1981-07-01), None
patent: 58-202448 (1983-11-01), None
patent: 62-065326 (1987-03-01), None
patent: 62-121417 (1987-06-01), None
patent: 63-157419 (1988-06-01), None
patent: 401284793 (1989-11-01), None
patent: 04-305915 (1992-10-01), None
patent: 04-305917 (1992-10-01), None
patent: 06-124873 (1994-05-01), None
patent: 07-132262 (1995-05-01), None
patent: 07-220990 (1995-08-01), None
patent: 09-219361 (1997-08-01), None
patent: 409219361 (1997-08-01), None
patent: 10-228661 (1998-08-01), None
patent: 10-255319 (1998-09-01), None
patent: 10-303114 (1998-11-01), None
patent: 10-340846 (1998-12-01), None
patent: 11-176727 (1999-07-01), None
patent: 2000-058436 (2000-02-01), None
patent: 2001-091849 (2001-04-01), None
patent: 2004-193252 (2004-07-01), None
patent: WO 99/49504 (1999-09-01), None
patent: WO 03/077036 (2003-09-01), None
patent: WO 03/077037 (2003-09-01), None
patent: WO 2004/019128 (2004-03-01), None
patent: WO 2004/053596 (2004-06-01), None
patent: WO 2004/053950 (2004-06-01), None
patent: WO 2004/053951 (2004-06-01), None
patent: WO 2004/053952 (2004-06-01), None
patent: WO 2004/053953 (2004-06-01), None
patent: WO 2004/053954 (2004-06-01), None
patent: WO 2004/053955 (2004-06-01), None
patent: WO 2004/053956 (2004-06-01), None
patent: WO 2004/053957 (2004-06-01), None
patent: WO 2004/053958 (2004-06-01), None
patent: WO 2004/053959 (2004-06-01), None
patent: WO 2004/055803 (2004-07-01), None
patent: WO 2004/057589 (2004-07-01), None
patent: WO 2004/057590 (2004-07-01), None
M. Switkes et al., “Immersion Lithography at 157 nm”, MIT Lincoln Lab, Orlando Jan. 2001, Dec. 17, 2001.
M. Switkes et al., “Immersion Lithography at 157 nm”, J. Vac. Sci. Technol. B., vol. 19, No. 6, Nov./Dec. 2001, pp. 2353-2356.
M. Switkes et al., “Immersion Lithography: Optics for the 50 nm Node”, 157 Anvers-1, Sep. 4, 2002.
B.J. Lin, “Drivers, Prospects and Challenges for Immersion Lithography”, TSMC, Inc., Sep. 2002.
B.J. Lin, “Proximity Printing Through Liquid”, IBM Technical Disclosure Bulletin, vol. 20, No. 11B, Apr. 1978, p. 4997.
B.J. Lin, “The Paths to Subhalf-Micrometer Optical Lithography”, SPIE vol. 922, Optical/Laser Microlithography (1988), pp. 256-269.
G.W.W. Stevens, “Reduction of Waste Resulting from Mask Defects”, Solid State Technology, Aug. 1978, vol. 21 008, pp. 68-72.
S. Owa et al., “Immersion Lithography; its potential performance and issues”, SPIE Microlithography 2003, 5040-186, Feb. 27, 2003.
S. Owa et al., “Advantage and Feasibility of Immersion Lithography”, Proc. SPIE 5040 (2003).
Nikon Precision Europe GmbH, “Investor Relations—Nikon's Real Solutions”, May 15, 2003.
H. Kawata et al., “Optical Projection Lithography using Lenses with Numerical Apertures Greater than Unity”, Microelectronic Engineering 9 (1989), pp. 31-36.
J.A. Hoffnagle et al., “Liquid Immersion Deep-Ultraviolet Interferometric Lithography”, J. Vac. Sci. Technol. B., vol. 17, No. 6, Nov./Dec. 1999, pp. 3306-3309.
B.W. Smith et al., “Immersion Optical Lithography at 193nm”, FUTURE FAB International, vol. 15, Jul. 11, 2003.
H. Kawata et al., “Fabrication of 0.2 μm Fine Patterns Using Optical Projection Lithography with an Oil Immersion Lens”, Jpn. J. Appl. Phys. vol. 31 (1992), pp. 4174-4177.
G. Owen et al., “⅛ μm Optical Lithography”, J. Vac. Sci. Technol. B., vol. 10, No. 6, Nov./Dec. 1992, pp. 3032-3036.
H. Hogan, “New Semiconductor Lithography Makes a Splash”, PHOTONICS SPECTRA, Photonics TechnologyWorld, Oct. 2003 Edition, pp. 1-3.
S. Owa and N. Nagasaka, “Potential Performance and Feasability of Immersion Lithography”, NGL Workshop 2003, Jul. 10, 2003, Slide Nos. 1-33.
S. Owa et al., “Update on 193nm immersion exposure tool”, Litho Forum, International SEMATECH, Los Angeles, Jan. 27-29, 2004, Slide Nos. 1-51.
H. Hata, “The Development of Immersion Exposure Tools”, Litho Forum, International SEMATECH, Los Angeles, Jan. 27-29, 2004, Slide Nos. 1-22.
T. Matsuyama et al., “Nikon Projection Lens Update”, SPIE Microlithography 2004, 5377-65, Mar. 2004.
“Depth-of-Focus Enhancement Using High Refractive Index Layer on the Imaging Layer”, IBM Technical Disclosure Bulletin, vol. 27, No. 11, Apr. 1985, p. 6521.
A. Suzuki, “Lithography Advances on Multiple Fronts”, EEdesign, EE Times, Jan. 5, 2004.
B. Lin, Thek3coefficient in nonparaxial λ/NA scaling equations for resolution, depth of focus, and immersion lithography,J. Microlith., Microfab., Microsyst. 1(1):7-12 (2002).

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