Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2010-07-30
2011-10-18
Geyer, Scott B (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S113000, C438S456000, C438S458000
Reexamination Certificate
active
08039312
ABSTRACT:
A capped micro-electro-mechanical systems (MEMS) device is formed using a device wafer and a cap wafer. The MEMS device is located on a frontside of the device wafer. A frontside of a cap wafer is attached to the frontside of the device wafer. A first stressor layer having a tensile stress is applied to a backside of the cap wafer after attaching the frontside of the cap wafer to the frontside of the device wafer. The first stressor layer and the cap wafer are patterned to form an opening through the first stressor layer and the cap wafer after applying the first stressor layer. A conductive layer is applied to the backside of the cap wafer, including through the opening to the frontside of the device wafer.
REFERENCES:
patent: 5382551 (1995-01-01), Thakur et al.
patent: 6902656 (2005-06-01), Ouellet et al.
patent: 7046411 (2006-05-01), Fleming
patent: 2003/0228089 (2003-12-01), Blackstone
patent: 2008/0148864 (2008-06-01), Fleury et al.
patent: 2009/0160040 (2009-06-01), Nabki et al.
patent: 2009/0256236 (2009-10-01), Smeys et al.
U.S. Appl. No. 12/638,424, filed Dec. 15, 2009.
Gunturu Veera M.
Kamaraju Shivcharan V.
Karlin Lisa H.
Chiu Joanna G.
Clingan, Jr. James L.
Freescale Semiconductor Inc.
Geyer Scott B
LandOfFree
Method for forming a capped micro-electro-mechanical system... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for forming a capped micro-electro-mechanical system..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a capped micro-electro-mechanical system... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4283531