Light-emitting diode package with roughened surface portions...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

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C257S099000, C257S676000

Reexamination Certificate

active

08030674

ABSTRACT:
An LED package including a lead-frame, at least an LED chip and an encapsulant is provided. The lead-frame has a roughened surface, the LED chip is disposed on the lead-frame and electrically connected to the lead-frame, and the roughened surface is suitable to scatter the light emitted from the LED chip. In addition, the encapsulant encapsulates the LED chip and a part of the lead-frame, and the rest part of the lead-frame is exposed out of the encapsulant.

REFERENCES:
patent: 2006/0097366 (2006-05-01), Sirinorakul et al.
patent: M295725 (2006-08-01), None
Article titled “Trapped whispering-gallery optical modes in white light-emitting diode lamps with remote phosphor”, authored by Luo, et al., adopted from Applied Physics Letters 89, 041125(2006).

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