Semiconductor mask inspection using die-to-die and...

Image analysis – Applications – Manufacturing or product inspection

Reexamination Certificate

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Details

C438S016000

Reexamination Certificate

active

08036446

ABSTRACT:
A mask forming method includes preparing design data of mask including pattern regions having identical repetition patterns respectively, generating mask pattern data of mask based on the design data, generating inspection control information for controlling inspection of defect on mask based on the mask pattern data, the information including positional information of the pattern regions and inspection sensitivity information of the repetition pattern, providing the inspection control information to mask pattern data, forming mask pattern of mask based on the mask pattern data, and inspecting the mask pattern based on the mask pattern data comprising inspecting portion in the mask pattern different from the pattern regions by Die-to-Database comparison method, the inspecting the portion including selecting portion corresponding to repetition pattern from the mask pattern based on the positional information, and inspecting the selected portion by Die-to-Die comparison method at an inspection sensitivity corresponding to inspection sensitivity information.

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Notice of Reasons for Rejection mailed by the Japanese Patent Office on Sep. 28, 2010, in Japanese patent application No. 2005-152435.

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