Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate
2010-04-14
2011-10-25
Thai, Luan C (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Alignment marks
C257SE23179
Reexamination Certificate
active
08044525
ABSTRACT:
The invention relates to a substrate with a check mark and a method of inspecting position accuracy of conductive glue dispensed on the substrate. The method is implemented on the substrate having at least one transfer pad and at least one check mark arranged near the border of the transfer pad. After the conductive glue spot is dispensed on the transfer pad, the method includes first capturing an image by a video capturing element, then determining whether the conductive glue spot exist in the image and determining whether the conductive glue spot from the image matches a predetermined standard, if not, generating a report and a warning.
REFERENCES:
patent: 6816521 (2004-11-01), Zetterlund et al.
patent: 6992735 (2006-01-01), Kim
patent: 7264994 (2007-09-01), Noda
patent: 7264997 (2007-09-01), Kameyama et al.
patent: 7750457 (2010-07-01), Seko
patent: 7786747 (2010-08-01), Shih et al.
patent: 7928591 (2011-04-01), Chen
patent: 2007/0052344 (2007-03-01), Wen et al.
patent: 2007/0190747 (2007-08-01), Humpston et al.
patent: 100381918 (2008-04-01), None
AU Optronics Corporation
Thai Luan C
Thomas Kayden Horstemeyer & Risley LLP
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