Heat sink for memory and memory device having heat sink

Details Heat sink for memory and memory device having heat sink Heat sink for memory and memory device having heat sink

2010-06-18

2011-11-15

Datskovskiy, Michail V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679530, C361S679540, C361S700000, C361S715000, C361S679460, C165S104210, C165S104260, C165S104330

Reexamination Certificate

active

08059406

ABSTRACT:
In a memory device and its heat sink, the memory device includes a memory, a heat sink mounted onto the memory and a clamping element, and the heat sink includes an isothermal vapor chamber plate and a heat dissipating body, and the isothermal vapor chamber plate is attached onto an external side of the memory and includes an insert portion, and the heat dissipating body includes a base plate, a plurality of heat dissipating fins extended from the base plate, and a pawl arm extended from the base plate and in an opposite direction of the fins, and the heat dissipating body is coupled to the insert portion in a replaceable manner by the pawl arm, and the clamping element is provided for clamping the base plate and the isothermal vapor chamber plate, such that the heat dissipating body can be replaced on the isothermal vapor chamber plate easily.

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