Semiconductor package

Details Semiconductor package Semiconductor package

2009-02-26

2011-11-01

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S712000, C257SE23113, C165S080200

Reexamination Certificate

active

08049316

ABSTRACT:
A semiconductor package is provided with a package body including a base part and a semiconductor device housing part housing a semiconductor device. An electric terminal electrically connected to the device is provided in the housing part and is exposed to an outer surface. A high heat transfer element is arranged from a heat generating part corresponding position corresponding to a heat generating part of the device to a position outside the corresponding position in the base part. The base part is configured by contacting a plurality of thin sheets mutually closely with each other and by bonding integrally with each other. The high heat transfer element includes particles configured by a material having a thermal conductivity higher than that of the base part and dispersed in the base part. The particles are dispersed between two mutually adjacent thin sheets among the thin sheets.

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