Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2009-02-20
2011-11-15
Angwin, David (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S834000
Reexamination Certificate
active
08056222
ABSTRACT:
A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to “wire” the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system.
REFERENCES:
patent: 6177151 (2001-01-01), Chrisey et al.
patent: 6488721 (2002-12-01), Carlson
patent: 6805918 (2004-10-01), Auyeung et al.
patent: 6815015 (2004-11-01), Young et al.
patent: 6887650 (2005-05-01), Shimoda et al.
patent: 6986199 (2006-01-01), Arnold et al.
patent: 7294367 (2007-11-01), Barron et al.
patent: 7358169 (2008-04-01), Zhu et al.
patent: 7381440 (2008-06-01), Ringeisen et al.
patent: 7427359 (2008-09-01), Arnold et al.
patent: 7786839 (2010-08-01), Soendker et al.
patent: 7875324 (2011-01-01), Barron et al.
patent: 7943287 (2011-05-01), Yamazaki et al.
patent: 2006/0105549 (2006-05-01), Duineveld et al.
Holmes et al, Multilayer Electroformed Devices on Silicon Substrates, J. Microelectromech. Syst., 7, (1998) 416.
Holmes, et al., Laser-Assisted Assembly for Hybrid Microelectromechanical Systems, Proc. 19th Int. Congress Applications of Lasers & Electro-Optics (ICALEO), Dearborn, USA, (2000) p. D-1.
Karlitskaya et al., Study of laser die release by Q-switched Nd:YAG laser pulses, SPIE Proc. 5448, (2004) 935.
Pique, et al., Assembly and Integration of Thin Bare Die Using Laser Direct-Write, Proc. of SPIE vol. 6458 6458025, 2007.
Pique, et. al., Applications of laser direct write for embedding electronics, Proc. of SPIE vol. 6606 66060R-1, 2007.
Mathews, et. al., Manufacturing Microelectronics using Lase and Place, Photonics Spectra, V. 10, p. 70, 2007.
Mathews, et. al., Use of Laser Direct-Write in Microelectronics Assembly, Journal of Laser Micro/Nanoengineering vol. 2, No. 1, p. 103, 2007.
Auyeung Raymond C Y
Mathews Scott A
Pique Alberto
Sood Bhanu Pratrap
Angwin David
Ressing Amy
Roberts Roy
The United States of America as represented by the Secretary of
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