Memory device and manufacturing method the same

Active solid-state devices (e.g. – transistors – solid-state diode – Organic semiconductor material

Reexamination Certificate

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Details

C257S292000, C257S296000, C257SE29170, C257SE51001, C257SE51005, C257SE51018, C257SE51024, C365S072000

Reexamination Certificate

active

08030643

ABSTRACT:
A semiconductor device that can transmit and receive data without contact is popular partly as some railway passes, electronic money cards, and the like; however, it has been a prime task to provide an inexpensive semiconductor device for further popularization. In view of the above current conditions, a semiconductor device of the present invention includes a memory with a simple structure for providing an inexpensive semiconductor device and a manufacturing method thereof. A memory element included in the memory includes a layer containing an organic compound, and a source electrode or a drain electrode of a TFT provided in the memory element portion is used as a conductive layer which forms a bit line of the memory element.

REFERENCES:
patent: 5313101 (1994-05-01), Harada et al.
patent: 5341026 (1994-08-01), Harada et al.
patent: 5650834 (1997-07-01), Nakagawa et al.
patent: 5930667 (1999-07-01), Oda
patent: 5952789 (1999-09-01), Stewart et al.
patent: 6243069 (2001-06-01), Ogawa et al.
patent: 6507010 (2003-01-01), Yamazaki et al.
patent: 2001/0043168 (2001-11-01), Koyama et al.
patent: 2003/0118927 (2003-06-01), Nakamura et al.
patent: 2003/0134146 (2003-07-01), Aziz et al.
patent: 2003/0183699 (2003-10-01), Masui
patent: 2006/0175648 (2006-08-01), Asami
patent: 2006/0186804 (2006-08-01), Sakakura et al.
patent: 2007/0153565 (2007-07-01), Nomura et al.
patent: 2007/0200125 (2007-08-01), Ikeda et al.
patent: 2007/0230235 (2007-10-01), Abe et al.
patent: 2001-345431 (2001-12-01), None
patent: 2004-128471 (2004-04-01), None
patent: WO 02/37500 (2002-05-01), None
patent: WO 2004/015778 (2004-02-01), None
patent: WO 2006/043573 (2006-04-01), None

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