Metal plating compositions

Details Metal plating compositions Metal plating compositions

2008-04-02

2011-11-01

Wong, Edna (Department: 1759)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

C205S239000, C205S241000, C205S242000, C205S247000, C205S252000, C205S253000, C205S255000, C205S257000, C205S259000, C205S261000, C205S263000, C205S264000, C205S265000, C205S266000, C205S267000, C205S271000, C205S276000, C205S280000, C205S291000, C205S296000, C205S300000, C205S302000, C205S303000, C106S001250, C106S001260, C106S001270, C106S001280

Reexamination Certificate

active

08048284

ABSTRACT:
Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

REFERENCES:
patent: 2752312 (1956-06-01), Dixon
patent: 3160611 (1964-12-01), Runge
patent: 4452922 (1984-06-01), Speranza et al.
patent: 6425996 (2002-07-01), Dahms et al.
patent: 2003/0226758 (2003-12-01), Egli
patent: 2006/0065536 (2006-03-01), Jentz et al.
patent: 40321 (1973-09-01), None
patent: 0 770 711 (2001-05-01), None
patent: WO 2004/100904 (2004-11-01), None
European Search Report of corresponding European Application No. 08 25 1284.

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