Mold assembly

Plastic article or earthenware shaping or treating: apparatus – With apparatus assembly or dismantling means or with idle part

Reexamination Certificate

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Details

C249S102000, C249S111000, C249S155000, C425S195000, C425S522000, C425S526000

Reexamination Certificate

active

08070470

ABSTRACT:
A mold assembly has two mold half shells each having an outer and inner wall for defining the shape of a container to be formed. Two mold half carriers each have an inner wall overlaying and spaced from a corresponding mold shell outer wall for supporting the shells in the assembly. At least one insulating pad is sandwiched between the inner wall and the corresponding outer wall and is secured to one of the inner wall and the outer wall. The pad supports the outer wall in non-contacting and buffering relation relative the carrier inner wall. Each pad may be secured in a recessed seat in the respective wall. Pads may be secured in recessed seats having a depth less than the thickness of the pad. Pads absorb mold operational forces to reduce wear, reduce conduction from shell to carrier and facilitate the use of different-sized shells with one carrier.

REFERENCES:
patent: 170464 (1875-11-01), Bakewell, Jr.
patent: 705772 (1902-07-01), Messer
patent: 791240 (1905-05-01), Boucher
patent: 3380121 (1968-04-01), Chittenden et al.
patent: 3768948 (1973-10-01), Horberg, Jr. et al.
patent: 3861640 (1975-01-01), Agneta
patent: 3978910 (1976-09-01), Gladwin
patent: 4032278 (1977-06-01), Kuenzig et al.
patent: 4151976 (1979-05-01), Schurman
patent: RE30215 (1980-02-01), Kuenzig et al.
patent: 4330248 (1982-05-01), Platte
patent: 4476170 (1984-10-01), Jabarin
patent: 4699585 (1987-10-01), Giese et al.
patent: 4815960 (1989-03-01), Rudolph
patent: 4822543 (1989-04-01), Iizuka et al.
patent: 4863046 (1989-09-01), Collette et al.
patent: 4884961 (1989-12-01), Iizuka et al.
patent: 4927680 (1990-05-01), Collette et al.
patent: 5217729 (1993-06-01), Terauchi et al.
patent: 5255889 (1993-10-01), Collette et al.
patent: 5411699 (1995-05-01), Collette et al.
patent: 5571474 (1996-11-01), Przytulla
patent: 5766299 (1998-06-01), Miller
patent: 5824237 (1998-10-01), Stumpf et al.
patent: 5968560 (1999-10-01), Briere et al.
patent: 6113377 (2000-09-01), Clark
patent: 6413075 (2002-07-01), Koch et al.
patent: 6428302 (2002-08-01), Tsau
patent: 6444159 (2002-09-01), Petre
patent: 6447281 (2002-09-01), Petre
patent: 6729868 (2004-05-01), Vogel et al.
patent: 6913455 (2005-07-01), Tsau et al.
patent: 6948924 (2005-09-01), Tsau et al.
patent: 6994542 (2006-02-01), Tsau et al.
patent: 7025584 (2006-04-01), Tsau
patent: 7335007 (2008-02-01), Perez et al.
patent: 2005/0006380 (2005-01-01), Kagan
patent: 2006/0219709 (2006-10-01), Kagan
patent: 2009/0232929 (2009-09-01), Blochmann et al.
patent: 2009/0263535 (2009-10-01), Tonga
patent: 2082350 (1993-05-01), None
patent: 2313881 (2002-01-01), None
patent: 2 240 300 (1991-07-01), None
patent: 63-202425 (1988-08-01), None
patent: 08174552 (1996-07-01), None

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