Chip carrier soldering tool

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces

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2281802, 228219, 228242, 228 20, B23K 112

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active

045641358

ABSTRACT:
A toll for melting solder on the contacts of a surface mounted electronic component and on the corresponding contacts of a printed circuit substrate to which it is to be soldered or from which it is to be de-soldered. The tool includes a conduit for conducting hot gas to the contacts. A diverter located in the interior of the conduit deflects hot gas away from the top of the surface mounted component and confines the hot gas to the periphery of the component.

REFERENCES:
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patent: 3328556 (1967-06-01), Nelson et al.
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patent: 4295596 (1981-10-01), Doten
patent: 4373658 (1983-02-01), March et al.
patent: 4426571 (1984-01-01), Beck
AT&T Technical Digest, Hot Air Device . . . Colderwood, Sep. 1984, No. 75, p. 11.
IBM Technical Disclosure, Solder Reflow Tool, C. Trollman, 3-69, vol. 11, No. 10, p. 1298.
"Guide for Removal, Replacement of Surface Mounted Devices-Part 3", By: John B. Holdway; Feb. 1985 issue of Electronics, pp. 23-26.

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