Solid state imaging device and manufacturing method thereof

Details Solid state imaging device and manufacturing method thereof Solid state imaging device and manufacturing method thereof

2006-03-24

2011-10-11

Nguyen, Thinh T (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S294000, C438S057000, C438S064000

Reexamination Certificate

active

08034652

ABSTRACT:
A plurality of sensor packages (4) are fixed to a circuit assembly board (47) and placed on a lower mold die (56) of a transfer molding apparatus (54). Attached inside a cavity (58a) of an upper mold die (58) is a protection sheet (65), which will make contact with the upper face of a cover glass (6) of each sensor package (4). When the upper mold die (58) meshes with the lower mold die (56), the upper face of the cover glass (6) is tightly covered with the protection sheet (65). A plunger (62) is activated to fill the cavities (56a,58a) with sealing resin (7). The upper face of the cover glass (6) is not stained or damaged when the peripheries of the sensor packages (4) are sealed.

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