Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-06-09
2011-11-01
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S678000, C257S680000, C257S682000, C257S684000, C257S688000, C257S701000, C257S702000, C257SE21499, C257SE23174
Reexamination Certificate
active
08049326
ABSTRACT:
An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.
REFERENCES:
patent: 5917272 (1999-06-01), Clark et al.
patent: 6232150 (2001-05-01), Lin et al.
patent: 6338284 (2002-01-01), Najafi et al.
patent: 6384353 (2002-05-01), Huang et al.
patent: 6391742 (2002-05-01), Kawai
patent: 6436853 (2002-08-01), Lin et al.
patent: 6569754 (2003-05-01), Wong et al.
patent: 6667558 (2003-12-01), Wong et al.
patent: 6673697 (2004-01-01), Ma et al.
patent: 6731180 (2004-05-01), Clark et al.
patent: 6815827 (2004-11-01), Vieux-Rochaz et al.
patent: 6903452 (2005-06-01), Ma et al.
patent: 6939778 (2005-09-01), Harpster et al.
patent: 6942750 (2005-09-01), Chou et al.
patent: 6954301 (2005-10-01), Nguyen et al.
patent: 7029829 (2006-04-01), Stark et al.
patent: 7045868 (2006-05-01), Ding et al.
patent: 7061086 (2006-06-01), Ferreiro et al.
patent: 7088032 (2006-08-01), Oita et al.
patent: 7098117 (2006-08-01), Najafi et al.
patent: 7196405 (2007-03-01), Ferreiro et al.
patent: 7303978 (2007-12-01), Ito
patent: 7309865 (2007-12-01), Ikushima et al.
patent: 7551048 (2009-06-01), Iwata et al.
patent: 7700957 (2010-04-01), Bieck et al.
patent: 2002/0185712 (2002-12-01), Stark et al.
patent: 2004/0067604 (2004-04-01), Ouellet et al.
patent: 2007/0277620 (2007-12-01), Melamud et al.
patent: 2008/0106347 (2008-05-01), Asamura et al.
Najafi, Khalil, Micropackaging Technologies For Integrated Microsystems: Applications to MEMS and MOEMS, Micromachining and Microfabrication Process Technology VIII, Proceedings of SPIE, vol. 4979, 2003, pp. 1-19.
Yoon, Sang Won, et al., Shock Protection Using Soft Coatings As Shock Stops, Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head Island, South Carolina, Jun. 4-8, 2006, pp. 396-399.
Mitchell, Jay, et al., Long-Term Reliability, Burn-In And Analysis of Outgassing In Au-Si Eutectic Wafer-Level Vacuum Packages, Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head Island, South Carolina, Jun. 4-8, 2006, pp. 376-379.
Welch, III, Warren, et al., Transient Liquid Phase (TLP) Bonding For Mirosystem Packaging Applications, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, Seoul, Korea, Jun. 5-9, 2005, pp. 1350-1353.
Chae, Junseok, et al., Wafer-Level Vacuum Package With Vertical Feedthroughs, IEEE, 2005, pp. 548-551.
Monajemi, Pejman, et al., A Low-Cost Wafer-Level MEMS Packaging Technology, IEEE, 2005, pp. 634-637.
Monajemi, Pejman, et al., Wafer-Level MEMS Packaging Via Thermally Released Metal-Organic Membranes, Institute of Physics Publishing, Journal of Micromechanics and Microengineering, vol. 16, 2006, pp. 742-750.
Lee, Sang-Hyun, et al., Low-Power Thermal Isolation For Environmentally Resistant Microinstrucments, IEEE, 2005, pp. 532-535.
Hopcroft, M.A., et al, Temperature Compensation of a MEMS Resonator Using Quality Factor As A Thermometer, MEMS 2006, Istanbul, Turkey, Jan. 22-26, 2006, pp. 222-225.
Jha, Chandra Mohan, et al., Thermal Isolation of Encapsulated MEMS Resonators, Journal of Microelectromechanical Systems, vol. 17, No. 1, Feb. 2008, pp. 175-184.
Asamura, Fumio, et al., Temperature Coefficients Improvements of VHF Oscillator Circuit for OCXO, IEEE, 2007, Japan, pp. 230-233.
Li, Xinghua, et al., High Density Electrical Feedthrough Fabricated By Deep Reactive ION Etching Of Pyrex Glass, IEEE 2001, Japan, pp. 98-101.
Yoon, S.W., et al., Shock Protection Using Integrated Nonlinear Spring Shock Stops, MEMS 2006, Istanbul, Turkey, Jan. 22-26, 2006, pp. 702-705.
Yoon, Sang Won, et al., Novel Integrated Shock Protection For MEMS, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, Seoul, Korea, Jun. 5-9, 2005, pp. 396-400.
Cheng, Y.T., et al., Vacuum Packaging Technology Using Localized Aluminum/Silicon-to-Glass Bonding, IEEE 2001, Berkley, California, pp. 18-21.
Slikkerveer, P.J., et al., High Quality Mechanical Etching of Brittle Materials By Powder Blasting, Elsevier Science, Sensors and Actuators, No. 85, 2000, pp. 296-303.
Lee Sang Woo
Lee Sang-Hyun
Najafi Khalil
Brooks & Kushman P.C.
Parker Kenneth
Spalla David
The Regents of the University of Michigan
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