Pressure-sensitive adhesive composition

Details Pressure-sensitive adhesive composition Pressure-sensitive adhesive composition

2004-08-05

2011-10-18

Eashoo, Mark (Department: 1767)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C524S505000

Reexamination Certificate

active

08039553

ABSTRACT:
The present invention relates to an adhesive composition comprising (A) a block copolymer composition comprising a block copolymer (a) formed from at least two polymer blocks composed mainly of a monoalkenyl aromatic compound and at least one polymer block composed mainly of a conjugated diene compound and a block copolymer (b) formed from a polymer block composed mainly of a monoalkenyl aromatic compound and a polymer block composed mainly of a conjugated diene compound, wherein the block copolymer (a) has a GPC peak molecular weight of 60,000 to 110,000 in terms of standard polystyrene, the polymer block composed mainly of a monoalkenyl aromatic compound has a peak molecular weight of 10,000 to 30,000 and a molecular weight distribution Mw/Mn of 1.0 to 1.6, the block copolymer composition (A) has a content of the block copolymer (b) of 50 to 90% by weight, the block copolymer composition (A) has a total monoalkenyl aromatic compound content of more than 40% by weight and 50% by weight or less, the conjugated diene unit has a vinyl bond content of less than 20%, and the block copolymer composition (A) has a viscosity in a 15% toluene solution of 10 to 40 cP at 25° C.

REFERENCES:
patent: 4080348 (1978-03-01), Korpman
patent: 4096203 (1978-06-01), St. Clair
patent: 4136071 (1979-01-01), Korpman
patent: 5089550 (1992-02-01), Sakagami et al.
patent: 5342685 (1994-08-01), Gobran
patent: 5583182 (1996-12-01), Asahara et al.
patent: 5891957 (1999-04-01), Hansen et al.
patent: 5948527 (1999-09-01), Gerard et al.
patent: 6277488 (2001-08-01), Kobe et al.
patent: 2002/0077420 (2002-06-01), Chiba et al.
patent: 2002/0147274 (2002-10-01), Sasagawa et al.
patent: 2003/0166774 (2003-09-01), Hoshi et al.
patent: 2004/0077789 (2004-04-01), Toda et al.
patent: 1 411 100 (2004-04-01), None
patent: 52-140544 (1977-11-01), None
patent: 60-226580 (1985-11-01), None
patent: 61-278578 (1986-12-01), None
patent: 63-248817 (1988-10-01), None
patent: 3-026747 (1991-02-01), None
patent: 3-285978 (1991-12-01), None
patent: 5-093176 (1993-04-01), None
patent: 5-263056 (1993-10-01), None
patent: 6-107745 (1994-04-01), None
patent: 6-228522 (1994-08-01), None
patent: 7-506747 (1995-07-01), None
patent: 2000-309767 (2000-11-01), None
patent: 2001-271049 (2001-10-01), None
patent: 2004-238548 (2004-08-01), None
patent: 92/20725 (1992-11-01), None
patent: 97/10310 (1997-03-01), None
patent: 02/057386 (2002-07-01), None
patent: WO 03/060009 (2003-07-01), None
English Language Abstract of JP 3-026747.
English Language Abstract of JP 5-263056.
English Language Abstract of JP 6-107745.
English Language Abstract of JP 52-140544.
English Language Abstract of JP 60-226580.
English Language Abstract of JP 5-093176.
English Language Abstract of JP 7-506747.
English Language Abstract of JP 6-228522.
English Language Abstract of JP 2004-238548.
English Language Abstract of JP 61-278578.
English Language Abstract of JP 63-248817.
English Language Abstract of JP 2001-271049.
English Language Abstract of JP 3-285978.
English Language Abstract of JP 2000-309767.

Affiliated with

Also associated with

Rating

Pressure-sensitive adhesive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pressure-sensitive adhesive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressure-sensitive adhesive composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4266663