Electronic element package and method of manufacturing the same

Details Electronic element package and method of manufacturing the same Electronic element package and method of manufacturing the same

2007-12-07

2011-12-13

Williams, Hezron E (Department: 2856)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C073S493000

Reexamination Certificate

active

08077447

ABSTRACT:
An electronic element package includes a plate-like sensor substrate with a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates, the sensor substrate including, a frame surrounding the detector via a space, beams joining the detector to the frame, and an electrode disposed on the frame and electrically connected to the detector, one of the first cover substrate and the second cover substrate having a through-hole which contacts an electrode. The electronic element package enables a reduction in thickness and offers improved reliability.

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