Cutting mold for rigid-flexible circuit board and method for...

Cutting – Other than completely through work thickness or through work... – Scoring

Reexamination Certificate

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C083S128000, C083S526000, C083S929100

Reexamination Certificate

active

08042445

ABSTRACT:
A cutting mold for removing two opposite superfluous rigid circuit boards from a rigid-flexible circuit board. A first cutter is connected to a first moldboard. A first barricade is connected to the first moldboard. The maximum vertical distance from the first barricade to the first moldboard exceeds that from the first cutter to the first moldboard. A second moldboard is opposite the first moldboard. The first and second moldboards move with respect to each other. A second cutter is connected to the second moldboard and corresponds to the first cutter. A second barricade is connected to the second moldboard and detachably abuts the first barricade. The maximum vertical distance from the second barricade to the second moldboard exceeds that from the second cutter to the second moldboard. The first and second cutters cut the superfluous rigid circuit boards when the first and second moldboards move toward each other.

REFERENCES:
patent: 1476706 (1923-12-01), Furber
patent: 2352339 (1944-06-01), Olney
patent: 3137188 (1964-06-01), Domka
patent: 3821911 (1974-07-01), Seme
patent: 6065381 (2000-05-01), Kim et al.
patent: 6475878 (2002-11-01), Slepcevic
patent: 6925922 (2005-08-01), Manabe et al.
patent: 7156943 (2007-01-01), Shimizu
patent: 2003/0200855 (2003-10-01), Wing et al.

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