Printed circuit board assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S679470, C361S679480, C361S679520, C361S679540, C361S695000, C361S697000, C361S700000, C361S704000, C361S709000, C361S710000, C165S080300, C165S185000, C174S015200, C174S016100, C174S016300

Reexamination Certificate

active

08072762

ABSTRACT:
A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating module is disposed on the first heat generating element. The first heat dissipating module includes a heat sink and a first heat pipe. The first heat pipe includes a pipe body and an extending portion extending from the pipe body. The second heat dissipating module is disposed on the second heat generating element. The pipe body is connected to the heat sink and the extending portion is connected to the second heat dissipating module.

REFERENCES:
patent: 7295437 (2007-11-01), Lee et al.
patent: 7520316 (2009-04-01), Xia et al.
patent: 7532476 (2009-05-01), Sauciuc
patent: 7694727 (2010-04-01), Yang et al.
patent: 7697293 (2010-04-01), Peng et al.
patent: 7753109 (2010-07-01), Min et al.
patent: 7755894 (2010-07-01), Yang et al.
patent: 7782617 (2010-08-01), Li et al.
patent: 2003/0183373 (2003-10-01), Sarraf et al.
patent: 2007/0263357 (2007-11-01), Ju
patent: 2007/0268670 (2007-11-01), Chu et al.
patent: 2009/0223647 (2009-09-01), Alousi et al.
patent: 2009/0321054 (2009-12-01), Qin et al.
patent: 2010/0002391 (2010-01-01), Jiang et al.
patent: 03074864 (1991-03-01), None
patent: 08222672 (1996-08-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printed circuit board assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit board assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4262322

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.