Semiconductor device with arrangement of parallel conductor...

Details Semiconductor device with arrangement of parallel conductor... Semiconductor device with arrangement of parallel conductor...

2009-03-20

2011-12-20

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S459000, C257S503000, C257S659000, C257S664000, C257S672000, C438S618000

Reexamination Certificate

active

08080880

ABSTRACT:
A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact pad is placed over the first conductor line. At least a portion of the first conductor line lies within a projection of the external contact pad on the semiconductor chip.

REFERENCES:
patent: 7307340 (2007-12-01), Baek et al.

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