Hybrid module and method of manufacturing the same

Details Hybrid module and method of manufacturing the same Hybrid module and method of manufacturing the same

1997-07-16

1999-03-02

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257698, 257679, H01L 23053, H01L 2312

Patent

active

058775501

ABSTRACT:
A hybrid module comprises a plurality of insulating layers which are laminated on one another and circuit patterns formed on each surface of the insulating layers and/or formed between the insulating layers, wherein the circuit patterns are connected with one another by through hole conductors. Further, the insulating layers are formed of layers each having a transmitting a laser beam, wherein the circuit patterns, which are formed between the insulating layers and overlaid on top of one another, are irradiated with a laser beam to be thermally fused.

REFERENCES:
patent: 4612083 (1986-09-01), Yasumoto et al.
patent: 5280192 (1994-01-01), Kryzaniwsky
patent: 5565706 (1996-10-01), Miura et al.
patent: 5600541 (1997-02-01), Bone et al.

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