Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2009-12-31
2011-10-25
Brewster, William M. (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S675000
Reexamination Certificate
active
08043896
ABSTRACT:
In a semiconductor chip, a body has a top surface where a pattern is formed, an underside surface opposing the top surface and a plurality of side surfaces. A plurality of electrode pads are formed on the top surface of the body to connect to an external terminal. A shielding conductive film is formed on the surfaces excluding the top surface of the body where the pattern is formed. A conductive via is extended through the body to connect one of the electrode pads with the conductive film.
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Lee Tae Soo
Park Yun Hwi
Brewster William M.
McDermott Will & Emery LLP
Samsung Electro-Mechanics Co. Ltd.
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