Method for manufacturing a wiring board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S830000, C029S831000, C029S832000, C029S852000, C174S250000

Reexamination Certificate

active

08037596

ABSTRACT:
A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof.

REFERENCES:
patent: 5305519 (1994-04-01), Yamamoto et al.
patent: 5316894 (1994-05-01), Takahashi et al.
patent: 5426849 (1995-06-01), Kimbara et al.
patent: 5436062 (1995-07-01), Schmidt et al.
patent: 5486492 (1996-01-01), Yamamoto et al.
patent: 6320240 (2001-11-01), Miyoshi
patent: 6629366 (2003-10-01), Kobayashi
patent: 2003/0204949 (2003-11-01), Chih
patent: 2004/0241904 (2004-12-01), Lee et al.
patent: 2006/0226202 (2006-10-01), Yang
patent: 10-107446 (1998-04-01), None
patent: 10-284835 (1998-10-01), None
patent: 2000-286362 (2000-10-01), None
patent: 2000-294678 (2000-10-01), None
patent: 2001-007240 (2001-01-01), None
patent: 2001-109162 (2001-04-01), None
patent: 2003-234578 (2003-08-01), None
patent: 2004-048048 (2004-02-01), None
patent: 2005-045163 (2005-02-01), None
patent: 2006-344664 (2006-12-01), None

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