Method for manufacturing a wiring board

Details Method for manufacturing a wiring board Method for manufacturing a wiring board

2007-11-28

2011-10-18

Banks, Derris (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S832000, C029S852000, C174S250000

Reexamination Certificate

active

08037596

ABSTRACT:
A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof.

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