Thermal protection method for a power device

Details Thermal protection method for a power device Thermal protection method for a power device

1989-11-20

1991-04-16

Hille, Rolf

357 28, 357 81, H01L 2336

Patent

active

050087363

ABSTRACT:
A thermally protected power transistor comprising a first chip which includes a power transistor and a second chip which includes protection circuitry. The second chip has a plurality of metallic bumps formed thereon which are coupled to various portions of the protection circuitry, wherein at least one metallic bump serves as a thermal couple. The protection circuitry chip is mounted upside down on the power transistor chip and coupled to the power transistor chip by the metallic bumps. The metallic bumps serve to provide electrical power for the protection circuitry, to couple control signals between the protection circuitry and the power transistor, and to couple thermal information from the power transistor to the protection circuitry.

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