Electronics package suitable for implantation

Surgery: light – thermal – and electrical application – Light – thermal – and electrical application – Electrical therapeutic systems

Reexamination Certificate

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Reexamination Certificate

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07835794

ABSTRACT:
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by applying conductive adhesive between electrical contacts and non-conductive underfill around the contacts. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

REFERENCES:
patent: 3699970 (1972-10-01), Brindley et al.
patent: 4573481 (1986-03-01), Bullara
patent: 4614194 (1986-09-01), Jones et al.
patent: 4837049 (1989-06-01), Byers
patent: 5006286 (1991-04-01), Dery et al.
patent: 5109844 (1992-05-01), de Juan, Jr. et al.
patent: 5215088 (1993-06-01), Normann
patent: 5468936 (1995-11-01), Deevi et al.
patent: 5876427 (1999-03-01), Chen et al.
patent: 5935155 (1999-08-01), Humayun et al.
patent: 6361716 (2002-03-01), Kleyer et al.
patent: 6400989 (2002-06-01), Eckmiller
patent: 6458157 (2002-10-01), Suaning
patent: 6800869 (2004-10-01), Liu
patent: 2003/0057535 (2003-03-01), Nguyen et al.
patent: 2005/0233172 (2005-10-01), Schulman et al.
Hansjoerg Beutel, et al.; Versatile ‘Microflex’-Based Interconnection Technique, Proc. SPIE Conf on Smart Electronics and MEMS, San Diego, CA, Mar. 1998, vol. 3328, pp. 174-182.
L.Del Castillo, et al.; Flip Chip Packaging of a MEMS Neuro-Prosthetic System; Proc IMAPS Int. Conf. & Exh on Advanced Packaging and Sys, Reno NV, Mar. 2002, pp. 158-163.
M. Pourbaix, Atlas of Electrochemical Equilibria in Aqueous Solutions, National Association of Corrosion Engineers, Houston, 1974, pp. 399-405.
Joseph V. Mantese, et al.; Platinum Wire Wedge Bonding: A New IC and Microsensor Interconnect; J Electronic Materials 17 (4) 1988, pp. 285-289.
Andreas Schneider, et al.; Flexible Interconnects for Biomedical Microsystems Assembly, IMAPS Conference, Jan. 31, 2002.

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