High capacity memory module using flexible substrate

Details High capacity memory module using flexible substrate High capacity memory module using flexible substrate

2007-06-08

2010-06-08

Le, Thao X (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257SE21511

Reexamination Certificate

active

07732903

ABSTRACT:
A memory module includes a module substrate and a plurality of package units mounted to the module substrate such that they partially overlap each other. Each package unit has at least one memory semiconductor package attached thereto. Each package unit includes a flexible substrate, which has outer terminals provided over a lower surface adjacent to one edge thereof to form electrical connections with the module substrate, and the memory semiconductor package attached to one surface or each of both upper and lower surfaces of the flexible substrate.

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patent: 08-125068 (1996-05-01), None
patent: 1020060134969 (2006-12-01), None
patent: 1020060134969 (2006-12-01), None

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